Copper-clad laminates CGP-500A

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CGP-500A

CGP-500A

The Copper-clad laminated circuit board using flouroplastic impregnated glass fabric as the dielectric.
Obtaining characteristics of fluoroplastic, it also has stable permittivity in wide frequency band and a very small dielectric loss tangent in the high frequency band.

Use

Satellite communication/Satellite broadcasting/All mobile communication systems/ETC or AHS in ITS/Regional wireless communications networks (WLL)/ CPU/Measuring instrument/Artificial satellite-mounted device

Operating temperature range

-60°C to +220°C

Structure

CGP-500A Structure

Characteristics

●It has excellent peeling strength, water absorption, and shows great performance with through hole machining.
●It has high dimensional stability and mechanical strength.
●It has 2.6 dielectric constant.

General dimensions table

General thickness (mm) Acceptable variation of thickness Dielectric constant Dissipation factor
1020×1200 510×1220 300×300
0.4 ±0.04 ±0.04 ±0.04 2.6 <0.0025
0.5 +0.04 ±0.03
0.6 +0.04 ±0.03
0.8 ±0.05 ±0.05 ±0.04
1.0 ±0.06 ±0.06 ±0.04
1.2 ±0.06 ±0.06 ±0.04
1.6 ±0.08 ±0.08 ±0.05
2.0 ±0.10 ±0.10 ±0.05
2.4 ±0.10 ±0.10 ±0.06
3.2 ±0.12 ±0.12 ±0.05
2.4 ±0.10 ±0.10 ±0.05
3.2 ±0.12 ±0.12 ±0.06

*CGP-500A has passed the UL certification.
*The tolerance of the dielectric constant is assumed to be ±0.05 for any one variety.

*As a standard we have used ½ oz. electrolytic copper foil on both sides. For other thicknesses of electrolytic copper foil, copper foil on one side, rolled copper foil, or in the case where other special measurements are necessary, please seek a special consultation from us directly.

Official thickness Purity
1/3oz 0.012mm ±0.003 99.8% or more
1/2oz 0.018mm ±0.005
1oz 0.035mm +0.010
-0.005
2oz 0.070mm +0.018
-0.008

General traits table

Test items Test conditions Measured value (1.6 mm thick)
Relative density A 2.2
Volume resistivity rate (Ω・cm) A 1015
C-96/40/90 1014
Surface resistance rate(Ω) A 1014
C-96/40/90 1014
Insulation resistance (Ω) A 1013
D-2/100 1013
line expansion coefficient (ppm/°C) ‐60°C to 150°C 21
Peel strength(kN/m) A 3
200°C atmosphere 1.5
Bending strength (N/mm2) A 100
Water absorption rate --- 0.01
Chemical resistivity --- Excellent
Combustability --- Incombustable

*Peel strength is standard value for 1 oz. (0.035mm) copper foil.

Products

Copper-clad laminates



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