Copper-clad laminates CGA-500

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CGA-500

CGA-500

The Copper-clad laminated circuit board using flouroplastic impregnated glass fabric containing inorganic filler as the dielectric.
Obtaining characteristics of fluoroplastic, it also has lower water absorbency than resins.

Use

Satellite communication/Satellite broadcasting/Receiving LNB/Transmitter

Operating temperature range

-60°C to +220°C

Structure

CGA-500 Structure

Characteristics

●It is suitable for mass production use while maintaining high frequency characteristics of fluoroplastic substrate.
●It has 3.0 dielectric constant.

General dimensions table

General thickness (mm) Acceptable variation of thickness Dielectric constant Dissipation factor
1020×1220 510×1220
0.4 ±0.05 3 <0.0030
0.5 ±0.05
0.6 ±0.06
0.8 ±0.08
1.0 ±0.10
1.2 ±0.12
1.6 ±0.20

*The dielectric constant is assumed to be 3.00. However, the dielectric constant varies with varying thickness.
The tolerance of the dielectric constant is assumed to be ±0.10 for any one variety.

*As a standard we have used ½ oz. electrolytic copper foil on both sides. For other thicknesses of electrolytic copper foil, copper foil on one side, rolled copper foil, or in the case where other special measurements are necessary, please seek a special consultation from us directly.

Official thickness Purity
1/2oz 0.018mm ±0.005 99.8% or more
1oz 0.035mm +0.010
-0.005
2oz 0.070mm +0.018
-0.008

General traits table

Test items Test conditions Measured value (1.6 mm thick)
Relative density A 2.3
Volume resistivity rate (Ω・cm) A 1015
C-96/40/90 1014
Surface resistance rate(Ω) A 1014
C-96/40/90 1014
Insulation resistance (Ω) A 1013
D-2/100 1010
line expansion coefficient (ppm/°C) ‐60°C to 150°C 20
Peel strength(kN/m) A 1.5
200°C atmosphere 1
Bending strength (N/mm2) A 60
Water absorption rate --- 0.02
Chemical resistivity --- Excellent
Combustability --- Incombustable

*Peel strength is standard value for 1 oz. (0.035mm) copper foil.

Products

Copper-clad laminates



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