Copper-clad laminates

CGA-500

  • Copper-clad laminates
  • high-frequency type
  • RoHS Directive

Overview

The Copper-clad laminated circuit board using flouroplastic impregnated glass fabric containing inorganic filler as the dielectric.
Obtaining characteristics of fluoroplastic, it also has lower water absorbency than resins.

Main applications

Satellite communication/Satellite broadcasting/Receiving LNB/Transmitter

Structure

Characteristics

• It is suitable for mass production use while maintaining high frequency characteristics of fluoroplastic substrate.
• It has 3.0 dielectric constant.

Typical dimensions

General thickness (mm)Acceptable variation of thicknessDielectric constantDissipation factor
1020×1220510×1220
0.4±0.053<0.0030
0.5±0.05
0.6±0.06
0.8±0.08
1.0±0.10
1.2±0.12
1.6±0.20

*The dielectric constant is assumed to be 3.00. However, the dielectric constant varies with varying thickness.
The tolerance of the dielectric constant is assumed to be ±0.10 for any one variety.
*As a standard we have used ½ oz. electrolytic copper foil on both sides. For other thicknesses of electrolytic copper foil, copper foil on one side, rolled copper foil, or in the case where other special measurements are necessary, please seek a special consultation from us directly.

Official thicknessPurity
1/2oz0.018mm±0.00599.8% or more
1oz0.035mm+0.010
-0.005
2oz0.070mm+0.018
-0.008

Typical properties

Test itemTest conditionMeasured value (1.6mm thick)
Specific gravityA2.2
Volume resistivity (Ω•cm)A1015
C-96/40/901014
Surface resistivity (Ω)A1014
C-96/40/901014
Insulation resistance (Ω)A1013
D-2/1001013
Linear expansion coefficient (ppm/℃)‐60℃ to 150℃21
Peel strength (kN/m)A3
200℃ atmosphere1.5
Bending strength (N/mm2)A100
Water absorption0.01
Chemical resistanceExcellent
FlammabilityIncombustable

*Peel strength is the measured value of 1 oz. (0.035mm) copper foil.
*Values shown in this table represent measurements and do not constitute guaranteed values.

Contact Information

Feel free to contact us for various inquiries, questions, or to request materials.