- Copper-clad laminates
- high-frequency type
- UL Standard
- RoHS Directive
The Copper-clad laminated circuit board using flouroplastic impregnated glass fabric containing inorganic filler as the dielectric.
Obtaining characteristics of fluoroplastic, it also has lower water absorbency than resins.
All mobile communication systems/Power amplifier for broadcast transmission and reception
• Compare to a general-purpose circuit board such as glass epoxy circuit board, this product provides low dielectric dissipation circuit even both have same level of permittivity.
• Low loss circuit can be obtained.
• It has 3.5 dielectric constant.
|General thickness (mm)||Acceptable variation of thickness||Dielectric constant||Dissipation factor|
*The dielectric constant is assumed to be 3.50. However, the dielectric constant varies with varying thickness.
*The tolerance of the dielectric constant is assumed to be ±0.12 for any one variety.
*As a standard we have used ½ oz. electrolytic copper foil on both sides. For other thicknesses of electrolytic copper foil, copper foil on one side, rolled copper foil, or in the case where other special measurements are necessary, please seek a special consultation from us directly.
|1/3oz||0.012mm||±0.003||99.8% or more|
|Test item||Test condition||Measured value (0.8mm thick)|
|Volume resistivity (Ω•cm)||A||1015|
|Surface resistivity (Ω)||A||1014|
|Insulation resistance (Ω)||A||1013|
|Linear expansion coefficient (ppm/℃)||‐60℃ to 150℃||15|
|Peel strength (kN/m)||A||1.5|
|Bending strength (N/mm2)||A||120|
*Peel strength is the measured value of 1 oz. (0.035mm) copper foil.
*Values shown in this table represent measurements and do not constitute guaranteed values.