- Copper-clad laminates
- high-frequency type
- RoHS Directive
The Copper-clad laminated circuit board using flouroplastic impregnated special glass fabric as the dielectric.
Compare to CGS-500A, it has less dielectric loss, and obtaining equivalent machining accuracy with CGP 500A.
Power amplifier for broadcast transmission and reception/All mobile communication systems
• It is suitable for the circuit of millimeter-wave and quasi-millimeter-wave.
• The dielectric loss is reduced below the half of CGP and it has excellent performance of more than 20GHz.
• It has 2.3 dielectric constant.
|General thickness (mm)||Acceptable variation of thickness||Dielectric constant||Dissipation factor|
*1) 1/2oz both sides εr=2.20
*2) 1/2oz both sides εr=2.25
*The dielectric constant is assumed to be 2.30. However, the dielectric constant varies with varying thickness.
*The tolerance of the dielectric constant is assumed to be ±0.05 for any one variety.
*As a standard we have used ½ oz. electrolytic copper foil on both sides. For other thicknesses of electrolytic copper foil, copper foil on one side, rolled copper foil, or in the case where other special measurements are necessary, please seek a special consultation from us directly.
|1/3oz||0.012mm||±0.003||99.8% or more|
|Test item||Test condition||Measured value (1.6mm thick)|
|Volume resistivity (Ω•cm)||A||1015|
|Surface resistivity (Ω)||A||1014|
|Insulation resistance (Ω)||A||1013|
|Linear expansion coefficient (ppm/℃)||‐60℃ to 150℃||25|
|Peel strength (kN/m)||A||1.5|
|Bending strength (N/mm2)||A||100|
*Peel strength is the measured value of 1 oz. (0.035mm) copper foil.
*Values shown in this table represent measurements and do not constitute guaranteed values.