- Copper-clad laminates
- high-frequency type
- UL Standard
- RoHS Directive
The Copper-clad laminated circuit board using flouroplastic impregnated glass fabric as the dielectric.
Obtaining characteristics of fluoroplastic, it also has stable permittivity in wide frequency band and a very small dielectric loss tangent in the high frequency band.
Satellite communication/Satellite broadcasting/All mobile communication systems/ETC or AHS in ITS/Regional wireless communications networks (WLL)/ CPU/Measuring instrument/Artificial satellite-mounted device
• It has excellent peeling strength, water absorption, and shows great performance with through hole machining.
• It has high dimensional stability and mechanical strength.
• It has 2.6 dielectric constant.
|General thickness (mm)||Acceptable variation of thickness||Dielectric constant||Dissipation factor|
*CGP-500A has passed the UL certification.
*The tolerance of the dielectric constant is assumed to be ±0.05 for any one variety.
*As a standard we have used ½ oz. electrolytic copper foil on both sides. For other thicknesses of electrolytic copper foil, copper foil on one side, rolled copper foil, or in the case where other special measurements are necessary, please seek a special consultation from us directly.
|1/3oz||0.012mm||±0.003||99.8% or more|
|Test item||Test condition||Measured value (1.6mm thick)|
|Volume resistivity (Ω•cm)||A||1015|
|Surface resistivity (Ω)||A||1014|
|Insulation resistance (Ω)||A||1013|
|Linear expansion coefficient (ppm/℃)||‐60℃ to 150℃||21|
|Peel strength (kN/m)||A||3|
|Bending strength (N/mm2)||A||100|
*Peel strength is the measured value of 1 oz. (0.035mm) copper foil.
*Values shown in this table represent measurements and do not constitute guaranteed values.