Copper-clad laminates CGH-500

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The Copper-clad laminated circuit board using flouroplastic impregnated glass fabric containing inorganic filler as the dielectric.
Obtaining characteristics of fluoroplastic, it also has lower water absorbency than resins.


All mobile communication systems/Power amplifier for broadcast transmission and reception

Operating temperature range

-60°C to +220°C


CGH-500 Structure


●Compare to a general-purpose circuit board such as glass epoxy circuit board, this product provides low dielectric dissipation circuit even both have same level of permittivity.
●Low loss circuit can be obtained.
●It has 3.5 dielectric constant.

General dimensions table

General thickness (mm) Acceptable variation of thickness Dielectric constant Dissipation factor
1020×1220 510×1220
0.8 ±0.05 3.5 <0.0032
1.0 ±0.06
1.2 ±0.06
1.6 ±0.08
2.0 ±0.10
2.4 ±0.10
3.2 ±0.12
4.0 ±0.12

*The dielectric constant is assumed to be 3.50. However, the dielectric constant varies with varying thickness.
*The tolerance of the dielectric constant is assumed to be ±0.12 for any one variety.

*As a standard we have used ½ oz. electrolytic copper foil on both sides. For other thicknesses of electrolytic copper foil, copper foil on one side, rolled copper foil, or in the case where other special measurements are necessary, please seek a special consultation from us directly.

Official thickness Purity
1/3oz 0.012mm ±0.003 99.8% or more
1/2oz 0.018mm ±0.005
1oz 0.035mm +0.010
2oz 0.070mm +0.018

General traits table

Test items Test conditions Measured value (0.8 mm thick)
Relative density A 2.3
Volume resistivity rate (Ω・cm) A 1015
C-96/40/90 1014
Surface resistance rate(Ω) A 1014
C-96/40/90 1014
Insulation resistance (Ω) A 1013
D-2/100 1012
line expansion coefficient (ppm/°C) ‐60°C to 150°C 15
Peel strength(kN/m) A 1.5
200°C atmosphere 1
Bending strength (N/mm2) A 120
Water absorption rate --- 0.02
Chemical resistivity --- Excellent
Combustability --- Incombustable

*Peel strength is standard value for 1 oz. (0.035mm) copper foil.


Copper-clad laminates

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